Comprehensive assessment of gait signals using multiple time scale features. - Xi Wu 003; Huitong Ding; Bing Nan Li; Ning An 001 (BIBM, 2014)

A study on gait-based Parkinson's disease detection using a force sensitive platform. - Xi Wu 003; Xu Chen; You Duan; Shengqiang Xu; Nan Cheng; Ning An 001 (BIBM, 2017)

Multi-kernel Collaboration-Induced Fuzzy Local Information C-Means Algorithm for Image Segmentation. - Yiming Tang 001; Xianghui Hu; Fuji Ren; Xiaocheng Song; Xi Wu 003 (ChineseCSCW, 2018)

Detecting Parkinson's Disease Using Gait Analysis with Particle Swarm Optimization. - Xu Chen; Xiaohui Yao; Chen Tang; Yining Sun; Xun Wang; Xi Wu 003 (HCI (27), 2018)

Towards Human Activity Recognition: A Hierarchical Feature Selection Framework. - Aiguo Wang; Guilin Chen; Xi Wu 003; Li Liu 001; Ning An 001; Chih-Yung Chang (Sensors, 2018)

uGait: A platform for automated quantitative gait analysis and its application to Parkinson's disease. - Xi Wu 003; Chen Tang; Xu Chen; Shengqiang Xu; Nan Cheng; Ning An 001 (Web Intell., 2018)

Function-Structure Collaborative Mapping Induced by Universal Triple I Systems. - Yiming Tang 001; Jingjing Chen; Fuji Ren; Xi Wu 003; Guangqing Bao (ChineseCSCW, 2019)

Semi-automatic Causal Graph Construction System. - Kun Cheng; Xiaoxuan Cui; Siyi Guo; Jiaoyun Yang; Xi Wu 003 (CSSE, 2020)

Modeling Method for Function Trees Guided by the Symmetric Quintuple Implicational Controller. - Yiming Tang 001; Xiaopeng Han; Xi Wu 003; Li Zhang (ChineseCSCW (1), 2021)

Automatic Life Event Tree Generation for Older Adults. - Fang Gui; Xi Wu 003; Min Hu; Jiaoyun Yang (HCI (46), 2022)

A Symmetric Bridge-Based Pre-Bond TSV Faults Detection Method. - Jun Liu 070; Zhi Chen; Songren Cheng; Chen Xiang; Tian Chen; Xi Wu 003; Yingchun Lu; Huaguo Liang (IEEE Trans. Instrum. Meas., 2024)

A Self-Biased Current Reference Source-Based Pre-Bond TSV Test Solution. - Jun Liu 070; Songren Cheng; Tian Chen; Xi Wu 003; Huaguo Liang (IEEE Trans. Very Large Scale Integr. Syst., 2024)

Voltage Skew-Based Test Technique for Pre-Bond TSVs in 3-D ICs. - Jun Liu 070; Zhi Chen; Tian Chen; Xi Wu 003; Huaguo Liang; Xiaohui Yuan 001 (IEEE Trans. Circuits Syst. II Express Briefs, 2024)