Effect of test condition and stress free temperature on the electromigration failure of Cu dual damascene submicron interconnect line-via test structures. - Arijit Roy 001; Cher Ming Tan; Rakesh Kumar; Xian Tong Chen (Microelectron. Reliab., 2005)

Modular sensor chip design for package stress evaluation and reliability characterisation. - A. D. Trigg; Tai Chong Chai; Xiaowu Zhang; Xian Tong Chen; Leong Ching Wai (Microelectron. Reliab., 2012)