Embedded manifold cooling for efficient thermal management of flexible electronics. - Xiangbin Du; Yuxin Ye; Yanmei Kong; Ruiwen Liu; Shichang Yun; Binbin Jiao; Lv Xiaorui; Pengrong Lin (NEMS, 2023)

Experimental investigations of manifold structure on cooling performance in embedded microfluidic cooling. - Wei Li; Yuxin Ye; Yingzhan Yan; Xiangbin Du; Yanmei Kong; Ruiwen Liu; Zhiqiang Wang; Binbin Jiao (NEMS, 2023)