Effects of coaxial through-silicon via on carrier mobility along [100] and [110] crystal directions of (100) silicon. - Fengjuan Wang; Ningmei Yu; Zhangming Zhu; Xiangkun Yin; Yintang Yang (IEICE Electron. Express, 2015)

Inductance of Different Profiles of Through Glass Vias based on magnetic flux density. - Yang Liu 106; Zhangming Zhu; Ruixue Ding; Xiaoxian Liu; Qijun Lu; Xiangkun Yin; Yintang Yang (APCCAS, 2018)

Electromagnetic modeling and analysis of the tapered differential through glass vias. - Yang Liu 106; Zhangming Zhu; Xiaoxian Liu; Qijun Lu; Xiangkun Yin; Lixin Guo; Yintang Yang (Microelectron. J., 2019)

Physics based scalable inductance model for three-dimensional solenoid inductors. - Yang Liu 106; Zhangming Zhu; Xiaoxian Liu; Qijun Lu; Xiangkun Yin; Yintang Yang (Microelectron. J., 2020)

Compact TSV-Based Hairpin Bandpass Filter for Thz Applications. - Fengjuan Wang; Lei Ke; Xiangkun Yin; Ningmei Yu; Yuan Yang 006 (IEEE Access, 2021)

TSV-based hairpin bandpass filter for 6G mobile communication applications. - Fengjuan Wang; Lei Ke; Xiangkun Yin; Vasilis F. Pavlidis; Ningmei Yu; Yuan Yang 006 (IEICE Electron. Express, 2021)

Analytical models of AC inductance and quality factor for TSV-based inductor. - Xiangkun Yin; Fengjuan Wang (IEICE Electron. Express, 2021)

A transformer with high coupling coefficient and small area based on TSV. - Fengjuan Wang; Ruinan Ren; Xiangkun Yin; Ningmei Yu; Yuan Yang 006 (Integr., 2021)

Design of compact LC lowpass filters based on coaxial through-silicon vias array. - Xiangkun Yin; Fengjuan Wang; Vasilis F. Pavlidis; Xiaoxian Liu; Qijun Lu; Tao Zhang 086; Yang Liu 106 (Microelectron. J., 2021)

A miniature TSV-based branch line coupler using π equivalent circuit model for transmission line. - Fengjuan Wang; Sa Xiao; Xiangkun Yin; Ningmei Yu; Yuan Yang 006 (IEICE Electron. Express, 2022)

Wideband transmission optimization for heterogenous interconnection in 3D IC. - Xiangkun Yin; Jingyu Lu; Fengjuan Wang (IEICE Electron. Express, 2022)

Compact high-performance dual-frequency power divider based on TSV. - Fengjuan Wang; Ruiqi Li; Xiangkun Yin; Ningmei Yu; Yuan Yang 006 (Microelectron. J., 2022)

Optimization of heterogeneous interconnection transmission based on impedance matching for 3-D IC high-frequency application. - Xiangkun Yin; Jingyu Lu; Fengjuan Wang (Microelectron. J., 2022)

A Miniaturized Wideband Interdigital Bandpass Filter With High Out-Band Suppression Based on TSV Technology for W-Band Application. - Fengjuan Wang; Kai Zhang; Xiangkun Yin; Ningmei Yu; Yuan Yang 006 (IEEE Trans. Very Large Scale Integr. Syst., 2022)

TSV-based SIW bandpass filter with adjustable transmission zeros for D-band applications. - Fengjuan Wang; Zhuoyu Yang; Xiangkun Yin; Ningmei Yu; Yuan Yang (IEICE Electron. Express, 2023)

Miniaturized silicon-based substrate integrated waveguide filter for 6G applications. - Fengjuan Wang; Ying Lu; Xiangkun Yin; Jiangfan Liu; Ningmei Yu; Yuan Yang 006 (Microelectron. J., 2023)

Effect of annealing residual stress on mobility of TSV vertical switch. - Fengjuan Wang; Jiashuo Ren; Xiangkun Yin; Ningmei Yu; Yuan Yang 006; Kai Jing; Qian Li (IEICE Electron. Express, 2024)

A compact fifth-order SIW BPF based on TSV technology with high selectivity. - Fengjuan Wang; Jilin Kou; Xiangkun Yin; Jiangfan Liu; Kai Jing; Ningmei Yu; Yuan Yang 006; Qian Li (Microelectron. J., 2024)

Parasitic-induced multi-zero generation and port-fusion compact filter based on 3-D through-silicon via technology. - Xiangkun Yin; Xiangyu Ma; Nairong Liu; Libo Qian; Tao Zhang 086; Qijun Lu; Zhangming Zhu (Microelectron. J., 2025)

A Wideband Compact Digitally-Assisted Variable Gain Phase Shifter for Ka-Band Applications. - Tao Zhang 086; Haohui Chen; Weihong Lu; Qijun Lu; Xiangkun Yin; Xin An; Bei Liu; Zhangming Zhu (IEEE Trans. Circuits Syst. II Express Briefs, 2025)