Machine Learning-Based Diagnosis of Defects in Chiplet Interconnects. - Junming Li; Huaguo Liang; Xianrui Dou; Le Yu; Zhengfeng Huang; Yingchun Lu; Cuiyun Jiang (3DIC, 2024)

Pulse-Based Prebond TSV Testing. - Xianrui Dou; Huaguo Liang; Zhengfeng Huang; Yingchun Lu; Tian Chen; Maoxiang Yi (IEEE Trans. Very Large Scale Integr. Syst., 2025)

A TSV Misalignment-Based Repair Architecture in 3-D Chips. - Huaguo Liang; Jiahui Xiao; Xianrui Dou; Tianming Ni; Yingchun Lu; Zhengfeng Huang (IEEE Trans. Very Large Scale Integr. Syst., 2025)