Achieving low temperature Cu to Cu diffusion bonding with self assembly monolayer (SAM) passivation. - Dau Fatt Lim; Shiv Govind Singh; Xiao Fang Ang; Jun Wei; Chee Mang Ng; Chuan Seng Tan (3DIC, 2009)

Low temperature Cu-Cu thermo-compression bonding with temporary passivation of self-assembled monolayer and its bond strength enhancement. - Chuan Seng Tan; Dau Fatt Lim; Xiao Fang Ang; Jun Wei; K. C. Leong (Microelectron. Reliab., 2012)