Breakdown data generation and in-die deconvolution methodology to address BEOL and MOL dielectric breakdown challenges. - Fen Chen; Carole Graas; Michael A. Shinosky; Kai Zhao; Shreesh Narasimha; Xiao Hu Liu; Chunyan Tian (Microelectron. Reliab., 2015)

Component-based workflows for parallel thermomechanical analysis of arrayed geometries. - Max O. Bloomfield; Zhen Li; Brian Granzow; Daniel Ibanez; Assad A. Oberai; Glen Hansen; Xiao Hu Liu; Mark S. Shephard (Eng. Comput., 2017)