3-D Printed Slotted Spherical Resonator Bandpass Filters With Spurious Suppression. - Fan Zhang 040; Sufang Gao; Jin Li 017; Yang Yu 068; Cheng Guo 006; Sheng Li; Moataz Attallah; Xiaobang Shang; Yi Wang 020; Michael J. Lancaster; Jun Xu (IEEE Access, 2019)

W-Band Waveguide Bandpass Filters Fabricated by Micro Laser Sintering. - Milan Salek; Xiaobang Shang; Robert C. Roberts; Michael J. Lancaster; Falko Boettcher; Daniel Weber 009; Thomas Starke (IEEE Trans. Circuits Syst. II Express Briefs, 2019)

Characterization of Dielectric Materials at WR-15 Band (50-75 GHz) Using VNA-Based Technique. - Yi Wang 020; Xiaobang Shang; Nick M. Ridler; Tongde Huang; Wen Wu 005 (IEEE Trans. Instrum. Meas., 2020)

Polymer-Based 3-D Printed 140-220 GHz Low-Cost Quasi-Optical Components and Integrated Subsystem Assembly. - Sang-Hee Shin; Xiaobang Shang; Nick M. Ridler; Stepan Lucyszyn (IEEE Access, 2021)

A microstrip filter direct-coupled amplifier based on active coupling matrix synthesis. - Yang Gao 020; Fan Zhang 040; Yingying Qiao; Jiawei Zang; Lei Li 029; Xiaobang Shang (Frontiers Inf. Technol. Electron. Eng., 2021)

Assessing the Impact of Data Filtering Techniques on Material Characterization at Millimeter-Wave Frequencies. - Dongdong Ma; Xiaobang Shang; Nick M. Ridler; Wen Wu 005 (IEEE Trans. Instrum. Meas., 2021)

3-D Printed Plug and Play Prototyping for Low-Cost Sub-THz Subsystems. - Sang-Hee Shin; Roshan Payapulli; Liyan Zhu; Manoj Stanley; Xiaobang Shang; Nick M. Ridler; Stepan Lucyszyn (IEEE Access, 2022)

A Sensor for Characterisation of Liquid Materials with High Permittivity and High Dielectric Loss. - Chen Wang 106; Xiaoming Liu; Zhixiang Huang; Shuo Yu 005; Xiaofan Yang; Xiaobang Shang (Sensors, 2022)

Design, Fabrication, and Characterization of a D-Band Bolometric Power Sensor. - Milan Salek; Murat Celep; Thomas Weimann; Daniel Stokes; Xiaobang Shang; Gia Ngoc Phung; Karsten Kuhlmann; James Skinner; Yi Wang 020 (IEEE Trans. Instrum. Meas., 2022)

Improvements to Millimeter-Wave Dielectric Measurement Using Material Characterization Kit (MCK). - Minjie Shu; Xiaobang Shang; Nick M. Ridler; Antoine R. Calleau; Alexandros I. Dimitriadis; Anxue Zhang (IEEE Trans. Instrum. Meas., 2024)