A Compile-Time Cost Model for Automatic OpenMP Decoupled Software Pipelining Parallelization. - Xiaoxian Liu; Rongcai Zhao; Lin Han (SNPD, 2013)

An Automatic Parallel-Stage Decoupled Software Pipelining Parallelization Algorithm Based on OpenMP. - Xiaoxian Liu; Rongcai Zhao; Lin Han; Peng Liu (TrustCom/ISPA/IUCC, 2013)

The impact of trapping centers on AlGaN/GaN resonant tunneling diode. - Haoran Chen; Lin-An Yang; Xiaoxian Liu; Zhangming Zhu; Jun Luo; Yue Hao 001 (IEICE Electron. Express, 2013)

Erratum: The impact of trapping centers on AlGaN/GaN resonant tunneling diode [IEICE Electronics Express Vol 10 (2013) No 19 pp 20130588]. - Haoran Chen; Lin-An Yang; Xiaoxian Liu; Zhangming Zhu; Jun Luo; Yue Hao 001 (IEICE Electron. Express, 2013)

Reduction of signal reflection in high-frequency three-dimensional (3D) integration circuits. - Xiaoxian Liu; Zhangming Zhu; Yintang Yang; Fengjuan Wang; Ruixue Ding (IEICE Electron. Express, 2013)

Analytical models for the thermal strain and stress induced by annular through-silicon-via (TSV). - Fengjuan Wang; Zhangming Zhu; Yintang Yang; Xiaoxian Liu; Ruixue Ding (IEICE Electron. Express, 2013)

Thermo-mechanical performance of Cu and SiO2 filled coaxial through-silicon-via (TSV). - Fengjuan Wang; Zhangming Zhu; Yintang Yang; Xiaoxian Liu; Ruixue Ding (IEICE Electron. Express, 2013)

A multiscale region-based approach to automatic SAR image registration using CLPSO. - Guiting Wang; Xiaoxian Liu; Licheng Jiao; Shuang Wang 001 (IGARSS, 2014)

Temperature properties of the parasitic resistance of through-silicon vias (TSVs) in high-frequency 3-D ICs. - Yintang Yang; Xiaoxian Liu; Zhangming Zhu; Ruixue Ding (IEICE Electron. Express, 2014)

Capacitance characterization of tapered through-silicon-via considering MOS effect. - Fengjuan Wang; Zhangming Zhu; Yintang Yang; Xiaoxian Liu; Ruixue Ding (Microelectron. J., 2014)

Inductance of Different Profiles of Through Glass Vias based on magnetic flux density. - Yang Liu 106; Zhangming Zhu; Ruixue Ding; Xiaoxian Liu; Qijun Lu; Xiangkun Yin; Yintang Yang (APCCAS, 2018)

Temperature-dependent characterizations on parasitic capacitance of tapered through silicon via (T-TSV). - Yang Liu 106; Zhangming Zhu; Xiaoxian Liu; Huaxi Gu; Lixin Guo (IEICE Electron. Express, 2018)

Broadband inductance modeling of TXVs for 3D interconnection. - Yang Liu 106; Zhangming Zhu; Xiaoxian Liu; Lixin Guo; Yintang Yang (Microelectron. J., 2019)

Electromagnetic modeling and analysis of the tapered differential through glass vias. - Yang Liu 106; Zhangming Zhu; Xiaoxian Liu; Qijun Lu; Xiangkun Yin; Lixin Guo; Yintang Yang (Microelectron. J., 2019)

Physics based scalable inductance model for three-dimensional solenoid inductors. - Yang Liu 106; Zhangming Zhu; Xiaoxian Liu; Qijun Lu; Xiangkun Yin; Yintang Yang (Microelectron. J., 2020)

Voltage Comparator With 60% Faster Speed by Using Charge Pump. - Haoyu Zhuang; He Tang; Xiaoxian Liu (IEEE Trans. Circuits Syst., 2020)

Voltage Reference With Linear-Temperature-Dependent Power Consumption. - Haoyu Zhuang; Xiaoxian Liu; Hao Wang 058 (IEEE Trans. Very Large Scale Integr. Syst., 2020)

Design of compact LC lowpass filters based on coaxial through-silicon vias array. - Xiangkun Yin; Fengjuan Wang; Vasilis F. Pavlidis; Xiaoxian Liu; Qijun Lu; Tao Zhang 086; Yang Liu 106 (Microelectron. J., 2021)

Area-Efficient Extended 3-D Inductor Based on TSV Technology for RF Applications. - Chenbing Qu; Zhangming Zhu; Yunfei En; Liwei Wang 003; Xiaoxian Liu (IEEE Trans. Very Large Scale Integr. Syst., 2021)

An effective method to suppress high-order modes of SIW filters with compact size. - Chenhui Fan; Xiaoxian Liu; Nuo Liu; Yintang Yang; Zhangming Zhu (Microelectron. J., 2022)

Filtering SIW phase shifter based on through quartz vias technology. - Nuo Liu; Xiaoxian Liu; Chenhui Fan (Microelectron. J., 2023)

Substrate-Integrated Waveguide Band-Pass Filter and Diplexer With Controllable Transmission Zeros and Wide-Stopband. - Xiaoxian Liu; Yang Liu 106; Tao Zhang 086; Qijun Lu; Zhangming Zhu (IEEE Trans. Circuits Syst. II Express Briefs, 2023)

A Composite Probe Capable of Simultaneously Measuring Two Orthogonal Magnetic-Fields. - Lei Wang 092; Xiaoxian Liu; Yunfei En; Zhangming Zhu (IEEE Trans. Circuits Syst. II Express Briefs, 2023)

A Ka-band fourth-order SIW filter power divider with wide out-of-band suppression. - Chenhui Fan; Xiaoxian Liu; Nuo Liu; Yintang Yang (Microelectron. J., 2023)

A Resonant Magnetic Probe Capable of Simultaneously Measuring Two Orthogonal Magnetic-Field Components. - Lei Wang 092; Xiaoxian Liu; Chengyang Luo 001; Zhangming Zhu (IEEE Trans. Circuits Syst. II Express Briefs, 2023)

An Evaluation of Ecosystem Quality and Its Response to Aridity on the Qinghai-Tibet Plateau. - Yimeng Yan; Jiaxi Cao; Yufan Gu; Xuening Huang; Xiaoxian Liu; Yue Hu; Shuhong Wu (Remote. Sens., 2024)

Compact On-Chip Half-Mode SIW-Based Dual-Band Bandpass Filter Using 3-D Stacked Inductors With Controllable Transmission Zero. - Nuo Liu; Xiaoxian Liu; Lei Zhang; Chenhui Fan; Zhangming Zhu (IEEE Trans. Very Large Scale Integr. Syst., 2025)