Distributed task migration for thermal hot spot reduction in many-core microprocessors. - Zao Liu; Xin Huang 003; Sheldon X.-D. Tan; Hai Wang 002; He Tang (ASICON, 2013)

Physics-based Electromigration Assessment for Power Grid Networks. - Xin Huang 003; Tan Yu; Valeriy Sukharev; Sheldon X.-D. Tan (DAC, 2014)

Accurate full-chip estimation of power map, current densities and temperature for EM assessment. - Marko Chew; Ara Aslyan; Jun-Ho Choy; Xin Huang 003 (ICCAD, 2014)

IR-drop based electromigration assessment: parametric failure chip-scale analysis. - Valeriy Sukharev; Xin Huang 003; Hai-Bao Chen; Sheldon X.-D. Tan (ICCAD, 2014)

Direct finite-element-based solver for 3D-IC thermal analysis via H-matrix representation. - Ying-Chi Li; Sheldon X.-D. Tan; Tan Yu; Xin Huang 003; Ngai Wong 001 (ISQED, 2014)

New electromigration modeling and analysis considering time-varying temperature and current densities. - Hai-Bao Chen; Sheldon X.-D. Tan; Xin Huang 003; Valeriy Sukharev (ASP-DAC, 2015)

Interconnect reliability modeling and analysis for multi-branch interconnect trees. - Hai-Bao Chen; Sheldon X.-D. Tan; Valeriy Sukharev; Xin Huang 003; Taeyoung Kim 001 (DAC, 2015)

EM-Based on-Chip Aging Sensor for Detection and Prevention of Counterfeit and Recycled ICs. - Kai He; Xin Huang 003; Sheldon X.-D. Tan (ICCAD, 2015)

H2-matrix-based finite element linear solver for fast transient thermal analysis of high-performance ICs. - Hai-Bao Chen; Sheldon X.-D. Tan; David H. Shin; Xin Huang 003; Hai Wang 002; Guoyong Shi (Int. J. Circuit Theory Appl., 2015)

H-Matrix-Based Finite-Element-Based Thermal Analysis for 3D ICs. - Hai-Bao Chen; Ying-Chi Li; Sheldon X.-D. Tan; Xin Huang 003; Hai Wang 002; Ngai Wong 001 (ACM Trans. Design Autom. Electr. Syst., 2015)

Task Migrations for Distributed Thermal Management Considering Transient Effects. - Zao Liu; Sheldon X.-D. Tan; Xin Huang 003; Hai Wang 002 (IEEE Trans. Very Large Scale Integr. Syst., 2015)

Electromigration recovery modeling and analysis under time-dependent current and temperature stressing. - Xin Huang 003; Valeriy Sukharev; Taeyoung Kim 001; Hai-Bao Chen; Sheldon X.-D. Tan (ASP-DAC, 2016)

Physics-based full-chip TDDB assessment for BEOL interconnects. - Xin Huang 003; Valeriy Sukharev; Zhongdong Qi; Taeyoung Kim 001; Sheldon X.-D. Tan (DAC, 2016)

Learning-based dynamic reliability management for dark silicon processor considering EM effects. - Taeyoung Kim 001; Xin Huang 003; Hai-Bao Chen; Valeriy Sukharev; Sheldon X.-D. Tan (DATE, 2016)

Voltage-based electromigration immortality check for general multi-branch interconnects. - Zeyu Sun 001; Ertugrul Demircan; Mehul D. Shroff; Taeyoung Kim 001; Xin Huang 003; Sheldon X.-D. Tan (ICCAD, 2016)

EM-Based On-Chip Aging Sensor for Detection of Recycled ICs. - Kai He; Xin Huang 003; Sheldon X.-D. Tan (IEEE Des. Test, 2016)

Electromigration assessment for power grid networks considering temperature and thermal stress effects. - Xin Huang 003; Valeriy Sukharev; Jun-Ho Choy; Marko Chew; Taeyoung Kim 001; Sheldon X.-D. Tan (Integr., 2016)

Analytical Modeling and Characterization of Electromigration Effects for Multibranch Interconnect Trees. - Hai-Bao Chen; Sheldon X.-D. Tan; Xin Huang 003; Taeyoung Kim 001; Valeriy Sukharev (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2016)

Physics-Based Electromigration Models and Full-Chip Assessment for Power Grid Networks. - Xin Huang 003; Armen Kteyan; Sheldon X.-D. Tan; Valeriy Sukharev (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2016)

Physics-Based Electromigration and Time Dependent Dielectric Breakdown Modeling and Reliability Analysis for Nanometer VLSI Circuits - Xin Huang 003 (2016)

Dynamic electromigration modeling for transient stress evolution and recovery under time-dependent current and temperature stressing. - Xin Huang 003; Valeriy Sukharev; Taeyoung Kim 001; Sheldon X.-D. Tan (Integr., 2017)