Design issues of a three-dimensional packaging scheme for power modules. - Shatil Haque; Kalyan Siddabattula; Mike Craven; Sihua Wen; Xingsheng Liu; Dushan Boroyevich; Guo-Quan Lu (Microelectron. Reliab., 2001)

Stacked solder bumping technology for improved solder joint reliability. - Xingsheng Liu; Shuangyan Xu; Guo-Quan Lu; David A. Dillard (Microelectron. Reliab., 2001)

Effect of substrate flexibility on solder joint reliability. - Xingsheng Liu; Shuangyan Xu; Guo-Quan Lu; David A. Dillard (Microelectron. Reliab., 2002)

Effect of substrate flexibility on solder joint reliability. Part II: finite element modeling. - Y. C. Lin; Xu Chen; Xingsheng Liu; Guo-Quan Lu (Microelectron. Reliab., 2005)

Research on seamless image stitching based on fast marching method. - Weidong Pan; Anhu Li; Yusheng Wu; Zhaojun Deng; Xingsheng Liu (IET Image Process., 2023)

Trigonometric projection statistics histograms for 3D local feature representation and shape description. - Xingsheng Liu; Anhu Li; Jianfeng Sun; Zhiyong Lu (Pattern Recognit., 2023)

Unmanned aerial vehicle image stitching based on multi-region segmentation. - Weidong Pan; Anhu Li; Xingsheng Liu; Zhaojun Deng (IET Image Process., 2024)