A 1596GB/s 48Gb Embedded DRAM 384-Core SoC with Hybrid Bonding Integration. - Xiping Jiang; Fengguo Zuo; Song Wang; Xiaofeng Zhou; Bing Yu; Yubing Wang; Qi Liu; Ming Liu; Yi Kang; Qiwei Ren (A-SSCC, 2021)

184QPS/W 64Mb/mm23D Logic-to-DRAM Hybrid Bonding with Process-Near-Memory Engine for Recommendation System. - Dimin Niu; Shuangchen Li; Yuhao Wang 002; Wei Han; Zhe Zhang 006; Yijin Guan; Tianchan Guan; Fei Sun; Fei Xue; Lide Duan; Yuanwei Fang; Hongzhong Zheng; et al. (ISSCC, 2022)

A 135 GBps/Gbit 0.66 pJ/bit Stacked Embedded DRAM with Multilayer Arrays by Fine Pitch Hybrid Bonding and Mini-TSV. - Song Wang; Bing Yu; Wenwu Xiao; Fujun Bai; Xiaodong Long; Liang Bai; Xuerong Jia; Fengguo Zuo; Jie Tan; Yixin Guo; Peng Sun; Jun Zhou; et al. (VLSI Technology and Circuits, 2023)

Research on Field Source Characteristics of Leakage Current of Arrester Based on TMR Sensor. - Yameng Fu; Tanxiao Li; Yongfu Li; Xiaoxu Hu; Xiping Jiang; Yiran Dong; Pengcheng Zhao; Chuanxiang Yu; Jingang Wang (Sensors, 2023)

Novel Diagnosis Method for GIS Mechanical Defects Based on an Improved Lightweight CNN Model With Load Adaptive Matching. - Yao Zhong; Jian Hao; Qingsong Lliu; Ying Li; Xu Li; Ruijin Liao; Xiping Jiang (IEEE Trans. Ind. Informatics, 2023)

Accurate positioning system in complex environment based on Beidou dual frequency differential positioning technology. - Xiping Jiang; Shihai Zhang; Haiyi Wan; Yongfu Li (Int. J. Inf. Commun. Technol., 2025)

A 3D Unified Analysis Method (3D-UAM) for Wafer-on-Wafer Stacked Near-Memory Structure. - Song Wang; Yixin Guo; Wei Tao; Xuerong Jia; Fujun Bai; Jie Tan; Yubing Wang; Liang Bai; Fuzhi Guo; Qi Liu; Jin Li; Peng Yin; et al. (IEEE Trans. Very Large Scale Integr. Syst., 2025)