Effect of substrate flexibility on solder joint reliability. Part II: finite element modeling. - Y. C. Lin; Xu Chen 039; Xingsheng Liu; Guo-Quan Lu (Microelectron. Reliab., 2005)

Effects of different bonding parameters on the electrical performance and peeling strengths of ACF interconnection. - Xu Chen 039; Jun Zhang; Chunlei Jiao; Yanmin Liu (Microelectron. Reliab., 2006)

Fatigue life evaluation of anisotropic conductive adhesive film joints under mechanical and hygrothermal loads. - Li-Lan Gao; Lei Wang 064; Hong Gao 003; Gang Chen 028; Xu Chen 039 (Microelectron. Reliab., 2011)

Ratcheting behavior of sandwiched assembly joined by sintered nanosilver for power electronics packaging. - Gang Chen 028; Ze-Sheng Zhang; Yun-Hui Mei; Xin Li 039; Guo-Quan Lu; Xu Chen 039 (Microelectron. Reliab., 2013)

High temperature ratcheting behavior of nano-silver paste sintered lap shear joint under cyclic shear force. - Xin Li 039; Gang Chen 028; Xu Chen 039; Guo-Quan Lu; Lei Wang 064; Yun-Hui Mei (Microelectron. Reliab., 2013)

Interfacial thermal stresses in ACF bonding assembly. - Li-Lan Gao; Xu Chen 039; Hong Gao 003 (Microelectron. Reliab., 2015)