Effects of process conditions on reliability, microstructure evolution and failure modes of SnAgCu solder joints. - Periannan Arulvanan; Zhaowei Zhong; Xunqing Shi (Microelectron. Reliab., 2006)

Protrusion of electroplated copper filled in through silicon vias during annealing process. - Si Chen 007; Fei Qin; Tong An; Pei Chen; Bin Xie; Xunqing Shi (Microelectron. Reliab., 2016)

Artificial Neural Network-Based Method for Identifying Under-Inflated Tire in Indirect TPMS. - Xiaoping Wang; Zhiwen Chen 005; Wan Cao; Guoliang Xu; Li Liu; Sheng Liu; Honglang Li; Xunqing Shi; Qinglin Song; Zhiyi Xiao; Chao Sun (IEEE Access, 2020)