Unified CAM-system architecture for die and mould manufacturing. - B. K. Choi; Y. C. Chung; J. W. Park; D. H. Kim (Comput. Aided Des., 1994)

Offset tool-path linking for pocket machining. - S. C. Park; Y. C. Chung (Comput. Aided Des., 2002)

Survivable Network Architectures for Wavelength-division-multiplexed Passive Optical Networks. - E. S. Son; K. H. Han; J. H. Lee; Y. C. Chung (Photonic Netw. Commun., 2006)

A novel hardware architecture of CAN applications. - Hong-Yuan Li; Jing-Jou Tang; C. T. Yu; W. W. Hu; Wan-Jung Chang; D. H. Lee; Y. C. Chung (ICCE, 2017)

Toward Practical RoF-based MFN for 5G Wireless Communication Systems. - B. G. Kim; Y. C. Chung (OECC/PSC, 2019)

High-Speed IM/DD System Based on OTDM Technique for Next-Generation Datacenter Network. - M. S. Kim; S. H. Bae; J. W. Park; K. Yu; Y. C. Chung (ICTON, 2023)

Unamplified 220-Gb/s × 20km C-band Transmission using Simplified Heterodyne Detection System. - B. G. Kim; Y. C. Chung (ICTON, 2024)