Fast implementation of recursive DFTs. - Y. Z. Zhang; Y. F. Yao (ICASSP, 1989)

Optimum removal of LCOs in digital filters. - Y. Z. Zhang; T. W. Cole; Y. F. Yao (ICASSP, 1990)

Parallel CFD Computation on Unstructured Grids. - Y. F. Yao; Brian E. Richards (Parallel CFD, 1997)

Surface topographical characterization of silver-plated film on the wedge bondability of leaded IC packages. - T. Y. Lin; K. L. Davison; W. S. Leong; Simon Chua; Y. F. Yao; J. S. Pan; J. W. Chai; K. C. Toh; W. C. Tjiu (Microelectron. Reliab., 2003)

Development of the green plastic encapsulation for high density wirebonded leaded packages. - T. Y. Lin; C. M. Fang; Y. F. Yao; K. H. Chua (Microelectron. Reliab., 2003)

Improving the deflection of wire bonds in stacked chip scale package (CSP). - Y. F. Yao; T. Y. Lin; K. H. Chua (Microelectron. Reliab., 2003)

New encapsulation development for fine pitch IC devices. - Y. F. Yao; B. Njoman; K. H. Chua; T. Y. Lin (Microelectron. Reliab., 2005)