Heat spreading packaging solutions for hybrid bonded 3D-ICs. - Rafael Prieto; Perceval Coudrain; Jean-Philippe Colonna; Y. Hallez; Christian Chancel; Venceslass Rat; Sylvain Dumas; G. Romano; R. Franiatte; C. Brunet-Manquiat; Séverine Cheramy; Alexis Farcy (3DIC, 2016)