Micro-XRD investigation of fine-pitch Cu-TSV induced thermo-mechanical stress in high-density 3D-LSI. - Mariappan Murugesan; Takafumi Fukushima; Ji Chel Bea; K. W. Lee; Mitsu Koyanagi; Y. Imai; S. Kimura; Tetsu Tanaka (3DIC, 2014)