Secure multiple-input single-output communication - Part I: secrecy rates and switched power allocation. - T. V. Nguyen; Y. Jeong; J. S. Kwak; H. Shin (IET Commun., 2014)

Secure multiple-input single-output communication - Part II: δ-secrecy symbol error probability and secrecy diversity. - T. V. Nguyen; Y. Jeong; J. S. Kwak; H. Shin (IET Commun., 2014)

Pure-Metal Replacement Gate for Reliable 30 nm Pitch Scaled 3D NAND Flash. - S. Rachidi; S. Ramesh; Davide Tierno; G. L. Donadio; A. Pacco; J. W. Maes; Y. Jeong; Antonio Arreghini; Geert Van den Bosch; Maarten Rosmeulen (IMW, 2024)

Investigation of the Impact of Ferroelectricity Boosted Gate Stacks for 3D NAND on Short Time Data Retention and Endurance. - Yusuke Higashi; J. P. Bastos; Adrian Vaisman Chasin; Laurent Breuil; Antonio Arreghini; S. Ramesh; S. Rachidi; Y. Jeong; Geert Van den Bosch; Maarten Rosmeulen (IRPS, 2024)

Exploring the Reliability Limits for the Z-Pitch Scaling of Molybdenum Inter-Word Line Oxides in 3D NAND. - Davide Tierno; Antonio Arreghini; Alicja Lesniewska; Y. Jeong; Marleen H. van der Veen; J. Stiers; N. Bazzazian; Ivan Ciofi; Geert Van den Bosch; Maarten Rosmeulen (IRPS, 2024)

Single-Power-Supply Compatible Cryogenic In0.8Ga0.2As Quantum-well HEMTs with Record Combination of high-frequency and low-noise performance for quantum-computins applications. - J.-H. Yoo; Y.-S. Jeon; S.-W. Son; I.-G. Lee; H.-B. Jo; S.-M. Choi; M.-S. Yu; W.-S. Park; H.-J. Kim; H.-J. Lee; S.-P. Son; S. K. Kim; et al. (VLSI Technology and Circuits, 2024)

Hole-Side Airgap Integration as Enabler for 3D NAND Flash Z-Pitch Scaling. - S. Rachidi; S. Ramesh; Devin Verreck; J. Loyo; Y. Jeong; H. Puliyalil; Jie Li; F. Seidel; Geert Van Den Bosch; Maarten Rosmeulen (IMW, 2025)

Advanced RTN Analysis on 3D NAND Trench Devices Using Physics-Informed Machine Learning Framework. - Yusuke Higashi; Anirudh Varanasi; Philippe J. Roussel; Pablo Saraza-Canflanca; J. P. Bastos; Alexander Grill; E. Catapano; R. Asanovski; Jacopo Franco; Ben Kaczer; Adrian Chasin; Devin Verreck; et al. (IRPS, 2025)