Evaluation of analytical models for thermal analysis and design of electronic packages. - Saeed Moghaddam; M. Rada; Amir Shooshtari; M. Ohadi; Y. Joshi (Microelectron. J., 2003)

Hybrid micro-nano structured thermal interfaces for pool boiling heat transfer enhancement. - S. Launay; Andrei G. Fedorov; Y. Joshi; A. Cao; P. M. Ajayan (Microelectron. J., 2006)

Improved compact thermal model for studying 3-D interconnect structures with low-k dielectrics. - A. Whelan; Y. Joshi; W. King (Microelectron. J., 2008)