Copper interconnect electromigration behaviors in various structures and lifetime improvement by cap/dielectric interface treatment. - M. H. Lin; Y. L. Lin; K. P. Chang; K. C. Su; Tahui Wang (Microelectron. Reliab., 2005)

A 45nm dual-port SRAM with write and read capability enhancement at low voltage. - D. P. Wang; Hung-Jen Liao; Hiroyuki Yamauchi; Y. H. Chen; Y. L. Lin; S. H. Lin; D. C. Liu; Huan-Cheng Chang; W. Hwang (SoCC, 2007)

Electrospun PVDF fibers on bio-wings using multi-spinnerets. - Chung-Kun Yen; C. H. Tsao; Cheng-Tang Pan; H. C. Wu; Y. C. Lai; Zong-Hsin Liu; Y. L. Lin; Liwei Lin; S. W. Kuo; Y. S. Lu; H. L. Hung; S. W. Mao; et al. (NEMS, 2014)

TSV by 355 UV laser for 4G component packaging with micro-electroforming. - Cheng-Tang Pan; Y. C. Chen; Shao-Yu Wang; Y. T. Cheng; Chung-Kun Yen; Y. L. Lin; W. C. Shih (Microelectron. Reliab., 2017)