Dynamic strength of anisotropic conductive joints in flip chip on glass and flip chip on flex packages. - Y. P. Wu; M. O. Alam; Yan Cheong Chan; B. Y. Wu (Microelectron. Reliab., 2004)

Bayesian Networks Modeling for Software Inspection Effectiveness. - Y. P. Wu; Q. P. Hu; Szu Hui Ng; Min Xie 001 (PRDC, 2005)

Detection and Correction Process Modeling Considering the Time Dependency. - Y. P. Wu; Q. P. Hu; Min Xie 001; Szu Hui Ng (PRDC, 2006)

A study of the modeling and analysis of software fault-detection and fault-correction processes. - Min Xie 001; Qingpei Hu; Y. P. Wu; Szu Hui Ng (Qual. Reliab. Eng. Int., 2007)

Modeling and Analysis of Software Fault Detection and Correction Process by Considering Time Dependency. - Y. P. Wu; Q. P. Hu; Min Xie 001; Szu Hui Ng (IEEE Trans. Reliab., 2007)