Kirkendall voids formation in the reaction between Ni-doped SnAg lead-free solders and different Cu substrates. - Yi-Wun Wang; Y. W. Lin; C. Robert Kao (Microelectron. Reliab., 2009)

Locomotion Control of a Biped Robot for Stair-climbing by Fuzzy Stabilization Tuning Approach. - Jonqlan Lin; Julian Chang; S. M. Lyu; S. W. Wang; Y. W. Lin (CCA, 2010)

New TDDB lifetime model for AC inverter-like stress in advance FinFET structure. - I. K. Chen; C. L. Chen; Y.-H. Lee; R. Lu; Y. W. Lee; H. H. Hsu; Y. W. Tseng; Y. W. Lin; J. R. Shih (IRPS, 2015)