An approach for fabricating high-performance inductors on low-resistivity substrates. - Ya-Hong Xie; Michel R. Frei; Andrew J. Becker; Clifford A. King; D. Kossives; L. T. Gomez; S. K. Theiss (IEEE J. Solid State Circuits, 1998)

Three-dimensional impedance engineering for mixed-signal system-on-chip applications. - Kyuchul Chong; Xi Zhang; King-Ning Tu; Daquan Huang; Mau-Chung Frank Chang; Ya-Hong Xie (CICC, 2005)

TLP evaluation of ESD protection capability of graphene micro-ribbons for ICs. - Wei Zhang 117; Qi Chen 008; Ming Xia; Rui Ma 003; Fei Lu 004; Chenkun Wang; Albert Z. Wang; Ya-Hong Xie (ASICON, 2015)

Characterization of single-crystalline graphene ESD interconnects. - Qi Chen 008; Cheng Li; Fei Lu 004; Chenkun Wang; Feilong Zhang 001; Tianru Wu; Xiaoming Xie; Kun Zhang; Xinxin Li; Jimmy Ng; Ya-Hong Xie; Yuhua Cheng; et al. (ASICON, 2017)

TLP measurement and analysis of graphene NEMS switches for on-chip ESD protection. - Qi Chen 008; Cheng Li; Fei Lu 004; Chenkun Wang; Feilong Zhang 001; Albert Z. Wang; Jimmy Ng; Ya-Hong Xie (NEMS, 2017)

Optimization of suspended graphene NEMS devices for electrostatic discharge applications. - Jimmy Ng; Wei Zhang 117; Ya-Hong Xie; Qi Chen 008; Rui Ma 003; Albert Z. Wang (NEMS, 2017)

More-Than-Moore: 3D heterogeneous integration into CMOS technologies. - Albert Z. Wang; Qi Chen 008; Cheng Li; Fei Lu 004; Chenkun Wang; Feilong Zhang 001; X. Shawn Wang; Jimmy Ng; Ya-Hong Xie; Rui Ma 003; Li Wang 058; Lin Lin 011 (NEMS, 2017)