Electro-thermal simulation of metal interconnections under high current flow. - Paolo Emilio Bagnoli; Yabin Zhang 003 (Microelectron. Reliab., 2010)

Modeling Methodology for Reliability-Concerned Current Density Analysis of PCB Tracks and Thermal Analysis of PCB Structure. - Yabin Zhang 003 (2013)

A modeling methodology for thermal analysis of the PCB structure. - Yabin Zhang 003; Paolo Emilio Bagnoli (Microelectron. J., 2014)

Improved Numerical-Analytical Thermal Modeling Method of the PCB With Considering Radiation Heat Transfer and Calculation of Components' Temperature. - Yabin Zhang 003 (IEEE Access, 2021)