Reliability study of the electroless Ni-P layer against solder alloy. - M. O. Alam; Yan Cheong Chan; K. C. Hung (Microelectron. Reliab., 2002)

Comparative study of the dissolution kinetics of electrolytic Ni and electroless Ni-P by the molten Sn3.5Ag0.5Cu solder alloy. - M. N. Islam; Yan Cheong Chan; Ahmed Sharif; M. O. Alam (Microelectron. Reliab., 2003)

The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications. - Chunyan Yin; M. O. Alam; Yan Cheong Chan; Chris Bailey 001; Hua Lu 003 (Microelectron. Reliab., 2003)

Contact resistance and adhesion performance of ACF interconnections to aluminum metallization. - J. H. Zhang; Yan Cheong Chan; M. O. Alam; S. Fu (Microelectron. Reliab., 2003)

Adhesion strength and contact resistance of flip chip on flex packages–effect of curing degree of anisotropic conductive film. - M. A. Uddin; M. O. Alam; Yan Cheong Chan; H. P. Chan (Microelectron. Reliab., 2004)

Dynamic strength of anisotropic conductive joints in flip chip on glass and flip chip on flex packages. - Y. P. Wu; M. O. Alam; Yan Cheong Chan; B. Y. Wu (Microelectron. Reliab., 2004)