Late Breaking Results: Analytical Placement for 3D ICs with Multiple Manufacturing Technologies. - Yan-Jen Chen; Yan-Syuan Chen; Wei-Che Tseng; Cheng-Yu Chiang; Yu-Hsiang Lo; Yao-Wen Chang (DAC, 2023)

Mixed-Size 3D Analytical Placement with Heterogeneous Technology Nodes. - Yan-Jen Chen; Cheng-Hsiu Hsieh; Po-Han Su; Shao-Hsiang Chen; Yao-Wen Chang (DAC, 2024)