Yang Liu

Orcid: 0000-0002-4311-2198

Affiliations:

Harbin University of Science and Technology, School of Material Science and Engineering, China
Delft University of Technology, Beijing Research Centre, China (former)
Harbin University of Science and Technology, China (PhD 2012)

According to our database¹, Yang Liu authored at least 5 papers between 2014 and 2018.

Collaborative distances:

Dijkstra number² of five.
Erdős number³ of five.

Timeline

Legend:

Book

In proceedings

Article

PhD thesis

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Bibliography

2018

A new hermetic sealing method for ceramic package using nanosilver sintering technology.

[BibT_eX]

[DOI]

Microelectron. Reliab., 2018

2015

Effect of elevated temperature on PCB responses and solder interconnect reliability under vibration loading.

[BibT_eX]

[DOI]

Microelectron. Reliab., 2015

Interfacial reaction and failure mode analysis of the solder joints for flip-chip LED on ENIG and Cu-OSP surface finishes.

[BibT_eX]

[DOI]

Microelectron. Reliab., 2015

2014

Evaluating board level solder interconnects reliability using vibration test methods.

[BibT_eX]

[DOI]

Microelectron. Reliab., 2014

Thermal and mechanical effects of voids within flip chip soldering in LED packages.

[BibT_eX]

[DOI]

Microelectron. Reliab., 2014

Yang Liu

Timeline

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Online presence:

On csauthors.net:

Bibliography

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