Yang Liu

Orcid: 0000-0001-6981-0974

Affiliations:
  • Xidian University, School of Microelectronics, Shaanxi Key Lab. of Integrated Circuits and Systems, Xi'an, China


According to our database1, Yang Liu authored at least 23 papers between 2014 and 2024.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Dataset
Other 

Links

Online presence:

On csauthors.net:

Bibliography

2024
A 64 × 64 Pixel Image Sensor With Gain-Configurable Photodiodes and Combined Subrange Method.
IEEE Trans. Instrum. Meas., 2024

2023
Advances in silicon-based in-sensor computing for neuromorphic vision sensors.
Microelectron. J., April, 2023

A Mixed Calibration Method of Time-to-Digital Converter for LiDAR Applications.
IEEE Trans. Circuits Syst. II Express Briefs, February, 2023

Substrate-Integrated Waveguide Band-Pass Filter and Diplexer With Controllable Transmission Zeros and Wide-Stopband.
IEEE Trans. Circuits Syst. II Express Briefs, February, 2023

SPAD-Based LiDAR With Real-Time Accuracy Calibration and Laser Power Regulation.
IEEE Trans. Circuits Syst. II Express Briefs, February, 2023

A 40-ps Resolution Robust Continuous Running VCRO-Based TDC for LiDAR Applications.
IEEE Trans. Circuits Syst. II Express Briefs, February, 2023

An Analog SiPM Based Receiver With On-Chip Wideband Amplifier Module for Direct ToF LiDAR Applications.
IEEE Trans. Circuits Syst. I Regul. Pap., January, 2023

2022
A Linear-Array Receiver AFE Circuit Embedded 8-to-1 Multiplexer for Direct ToF Imaging LiDAR Applications.
IEEE Trans. Circuits Syst. I Regul. Pap., 2022

A 50-ps Gated VCRO-Based TDC With Compact Phase Interpolators for Flash LiDAR.
IEEE Trans. Circuits Syst. I Regul. Pap., 2022

2021
Design of compact LC lowpass filters based on coaxial through-silicon vias array.
Microelectron. J., 2021

2020
Physics based scalable inductance model for three-dimensional solenoid inductors.
Microelectron. J., 2020

2019
Electromagnetic modeling and analysis of the tapered differential through glass vias.
Microelectron. J., 2019

Broadband inductance modeling of TXVs for 3D interconnection.
Microelectron. J., 2019

2018
Temperature-dependent characterizations on parasitic capacitance of tapered through silicon via (T-TSV).
IEICE Electron. Express, 2018

Inductance of Different Profiles of Through Glass Vias based on magnetic flux density.
Proceedings of the 2018 IEEE Asia Pacific Conference on Circuits and Systems, 2018

2016
Ku band damage characteristics of GaAs pHEMT induced by a front-door coupling microwave pulse.
Microelectron. Reliab., 2016

A Power-Efficient Compact Pipelined ADC for ZigBee Receiver Applications.
J. Circuits Syst. Comput., 2016

An IM2-free floating current buffer using average power based automatic calibration for IEEE 802.15.6 transmitter.
IEICE Electron. Express, 2016

2015
Analysis of high power microwave induced degradation and damage effects in AlGaAs/InGaAs pHEMTs.
Microelectron. Reliab., 2015

A low-distortion multi-bit sigma-delta ADC with mismatch-shaping DACs for WLAN applications.
Microelectron. J., 2015

Modeling and understanding of the frequency dependent HPM upset susceptibility of the CMOS inverter.
Sci. China Inf. Sci., 2015

2014
A fully integrated feedback AGC loop for ZigBee (IEEE 802.15.4) RF transceiver applications.
Microelectron. J., 2014

A novel hybrid two-stage IM2 cancelling technique for IEEE 802.15.6 HBC standard.
Proceedings of the IEEE Biomedical Circuits and Systems Conference, 2014


  Loading...