A Visual Inspection Method Based on Periodic Feature for Wheel Mark Defect on Wafer Backside. - YangSub Park; KilBum Kang; SeongSoo Kim (CAIP (1), 2017)

A Defect Inspection Method for Machine Vision Using Defect Probability Image with Deep Convolutional Neural Network. - Chanhee Jang; Sang-Yun Yun; Hyejin Hwang; Hyunmin Shin; SeongSoo Kim; YangSub Park (ACCV (1), 2018)

The Method to Measure Si Thickness for Bond Line Thickness. - YangSub Park; KilBum Kang; Sang-Yun Yun; SeongSoo Kim (ICPRAM, 2018)