ReRAM technology evolution for storage class memory application. - Yangyin Chen; Chris Petti (ESSDERC, 2016)

Thermally stable, packaged aware LV HKMG platforms benchmark to enable low power I/O for next 3D NAND generations. - Alessio Spessot; Shairfe Muhammad Salahuddin; Ricardo Escobar; Romain Ritzenthaler; Yang Xiang; Rahul Budhwani; Eugenio Dentoni Litta; Elena Capogreco; Joao P. Bastos; Yangyin Chen; Naoto Horiguchi (IMW, 2022)

Reliability Investigation of W2W Hybrid Bonding Interface: Breakdown Voltage and Leakage Mechanism. - Lin Hou; Emmanuel Chery; Kristof Croes; Davide Tierno; Soon Aik Chew; Yangyin Chen; Peter Rakbin; Eric Beyne (IRPS, 2022)