Growth behavior of Cu/Al intermetallic compounds and cracks in copper ball bonds during isothermal aging. - Chunjing Hang; Chunqing Wang; M. Mayer; Yanhong Tian; Norman Y. Zhou; Honghui Wang (Microelectron. Reliab., 2008)

Reliability and failure analysis of fine copper wire bonds encapsulated with commercial epoxy molding compound. - Yanhong Tian; Chunjin Hang; Chunqing Wang; G. Q. Ouyang; D. S. Yang; J. P. Zhao (Microelectron. Reliab., 2011)

Coupling effects of mechanical vibrations and thermal cycling on reliability of CCGA solder joints. - Ying Ding; Ruyu Tian; Xiuli Wang; Chunjin Hang; Fang Yu; Ling Zhou; Xiangang Meng; Yanhong Tian (Microelectron. Reliab., 2015)