Which interconnects for which 3D applications? Status and perspectives. - Yann Lamy; Jean-Philippe Colonna; G. Simon; Patrick Leduc; Séverine Cheramy; C. Laviron (3DIC, 2013)

Electrical model and characterization of Through Silicon Capacitors (TSC) in silicon interposer. - Khadim Dieng; Philippe Artillan; Cédric Bermond; Olivier Guiller; Thierry Lacrevaz; Sylvain Joblot; Gregory Houzet; Alexis Farcy; Yann Lamy; Bernard Fléchet (3DIC, 2014)