A low store energy and robust ReRAM-based flip-flop for normally off microprocessors. - Tsai-Kan Chien; Lih-Yih Chiou; Yao-Chun Chuang; Shyh-Shyuan Sheu; Heng-Yuan Li; Pei-Hua Wang; Tzu-Kun Ku; Ming-Jinn Tsai; Chih-I Wu (ISCAS, 2016)

Reliability Challenges from 2.5D to 3DIC in Advanced Package Development. - Ryan Lu; Yao-Chun Chuang; Jyun-Lin Wu; Jun He (IRPS, 2023)

Electromigration Performance of Cu Bumps in Various Configurations. - Jui-Shen Chang; Chung-Yu Chiu; Ching-Ting Liu; Chen-Nan Chiu; Yao-Chun Chuang; Ryan Lu (IRPS, 2025)

Characterization of Cu and SiCN Adhesion in BEOL Interconnections. - Chang-Fu Han; Jia-Ming Yang; Chia-Hua Chang; Yu-Sheng Lin; Jyun-Lin Wu; Yao-Chun Chuang; Ryan Lu (IRPS, 2025)

CoWoS Package Reliability Risk Assessment & Mitigation from Mechanical Perspectives. - Ching-Ting Liu; Yao-Chun Chuang; Jyun-Lin Wu; Jia-Shen Lan; Chang-Fu Han; Chia-Hua Chang; Jia-Ming Yang; Yu-Sheng Lin; Chen-Wei Li; Ryan Lu (IRPS, 2025)