Integration of intra chip stack fluidic cooling using thin-layer solder bonding. - Yassir Madhour; Michael Zervas; Gerd Schlottig; Thomas Brunschwiler; Yusuf Leblebici; John Richard Thome; Bruno Michel (3DIC, 2013)

STEAM: a fast compact thermal model for two-phase cooling of integrated circuits. - Arvind Sridhar; Yassir Madhour; David Atienza; Thomas Brunschwiler; John Richard Thome (ICCAD, 2013)