Optical TSV Using Si-Photonics Integrated Curved Micro-Mirror. - Akihiro Noriki; Isao Tamai; Yasuhiro Ibusuki; Akio Ukita; Satoshi Suda; Daisuke Shimura; Yosuke Onawa; Hiroki Yaegashi; Takeru Amano (3DIC, 2019)

Vertical Optical and Electrical Interconnection for Chip-Scale-Packaged Si Photonic Transceivers. - Koichi Takemura; Akio Ukita; Yasuhiro Ibusuki; Mitsuru Kurihara; Akihiro Noriki; Takeru Amano; Daisuke Okamoto; Yasuyuki Suzuki; Kazuhiko Kurata (3DIC, 2019)

Fingertip-Size Optical Module, "Optical I/O Core", and Its Application in FPGA. - Takahiro Nakamura; Kenichiro Yashiki; Kenji Mizutani; Takaaki Nedachi; Junichi Fujikata; Masatoshi Tokushima; Jun Ushida; Masataka Noguchi; Daisuke Okamoto; Yasuyuki Suzuki; Takanori Shimizu; Koichi Takemura; et al. (IEICE Trans. Electron., 2019)

Demonstration of Optical Re-Distribution on Silicon Photonics Die Using Polymer Waveguide and Micro Mirrors. - Akihiro Noriki; Isao Tamai; Yasuhiro Ibusuki; Akio Ukita; Satoshi Suda; Koichi Takemura; Daisuke Shimura; Yosuke Onawa; Hiroki Yaegashi; Takeru Amano (ECOC, 2020)

Polymer Waveguide-coupled Co-packaged Silicon Photonics-die Embedded Package Substrate. - Takeru Amano; Akihiro Noriki; Isao Tamai; Yasuhiro Ibusuki; Akio Ukita; Satoshi Suda; Takayuki Kurosu; Koichi Takemura; Tsuyoshi Aoki; Daisuke Shimura; Yosuke Onawa; Hiroki Yaegashi (OFC, 2021)