PDN impedance analysis of TSV-decoupling capacitor embedded Silicon interposer for 3D-integrated CMOS image sensor system. - Katsuya Kikuchi; Chihiro Ueda; Fumiaki Fujii; Yutaka Akiyama; Naoya Watanabe; Yasuhiro Kitamura; Toshio Gomyo; Toshikazu Okubo; Tetsuya Koyama; Tadashi Kamada; Masahiro Aoyagi; Kanji Otsuka (3DIC, 2011)

A hybrid structured turbo code of CBRM in conjunction with XOR coded parity compression. - Yasuhiro Kitamura; Shinsuke Ibi; Seiichi Sampei (ISITA, 2012)

The Error Prevention Mechanisms of Pointing: Eye Focusing and/or Memory Enhancing? - Takayuki Masuda; Masayoshi Shigemori; Yasuhiro Kitamura; Naohiro Akiu (HCI (28), 2013)

Transfer and non-transfer stacking technologies based on chip-to-wafer self-asembly for high-throughput and high-precision alignment and microbump bonding. - Takafumi Fukushima; Taku Suzuki; Hideto Hashiguchi; Chisato Nagai; Jichoel Bea; Hiroyuki Hashimoto; Mariappan Murugesan; Kang Wook Lee 002; Tetsu Tanaka; Kazushi Asami; Yasuhiro Kitamura; Mitsumasa Koyanagi (3DIC, 2015)