Solder joint reliability evaluation of chip scale package using a modified Coffin-Manson equation. - Ikuo Shohji; Hideo Mori; Yasumitsu Orii (Microelectron. Reliab., 2004)

High density 3D integration by pre-applied Inter Chip Fill. - Akihiro Horibe; Kuniaki Sueoka; Katsuyuki Sakuma; Sayuri Kohara; Keiji Matsumoto; Hidekazu Kikuchi; Yasumitsu Orii; Toshiro Mitsuhashi; Fumiaki Yamada (3DIC, 2010)

Combination between the nonlinear finite element analyses and the strain measurement using the digital image correlation for a new 3D SIC package. - Toru Ikeda; Masatoshi Oka; Shinya Kawahara; Noriyuki Miyazaki; Keiji Matsumoto; Sayuri Kohara; Yasumitsu Orii; Fumiaki Yamada; Morihiro Kada (3DIC, 2011)

Thermal stress analysis of die stacks with fine-pitch IMC interconnections for 3D integration. - Sayuri Kohara; Akihiro Horibe; Kuniaki Sueoka; Keiji Matsumoto; Fumiaki Yamada; Yasumitsu Orii; Katsuyuki Sakuma; Takahiro Kinoshita; Takashi Kawakami (3DIC, 2011)

Thermo-mechanical evaluation of 3D packages. - Sayuri Kohara; Akihiro Horibe; Kuniaki Sueoka; Keiji Matsumoto; Fumiaki Yamada; Hiroyuki Mori; Yasumitsu Orii (3DIC, 2013)

Thermal design guideline and new cooling solution for a three-dimensional (3D) chip stack. - Keiji Matsumoto; Soichiro Ibaraki; Kuniaki Sueoka; Katsuyuki Sakuma; Hidekazu Kikuchi; Hiroyuki Mori; Yasumitsu Orii; Fumiaki Yamada; Kohei Fujihara; Junichi Takamatsu; Koji Kondo (3DIC, 2013)

Cooling from the bottom side (laminate (substrate) side) of a three-dimensional (3D) chip stack. - Keiji Matsumoto; Hiroyuki Mori; Yasumitsu Orii (3DIC, 2014)

Vertical integration after stacking (ViaS) process for low-cost and low-stress 3D silicon integration. - Kuniaki Sueoka; Akihiro Horibe; T. Aoki; Sayuri Kohara; Kazushige Toriyama; Hiroyuki Mori; Yasumitsu Orii (3DIC, 2015)

An Information Extraction and Knowledge Graph Platform for Accelerating Biochemical Discoveries. - Matteo Manica; Christoph Auer; Valéry Weber; Federico Zipoli; Michele Dolfi; Peter W. J. Staar; Teodoro Laino; Costas Bekas; Akihiro Fujita; Hiroki Toda; Shuichi Hirose; Yasumitsu Orii (CoRR, 2019)

Molecular Inverse-Design Platform for Material Industries. - Seiji Takeda; Toshiyuki Hama; Hsiang-Han Hsu; Victoria A. Piunova; Dmitry Zubarev; Daniel P. Sanders 002; Jed W. Pitera; Makoto Kogoh; Takumi Hongo; Yenwei Cheng; Wolf Bocanett; Hideaki Nakashika; et al. (KDD, 2020)

Semiconductor Packaging Revolution in the Era of Chiplets. - Yasumitsu Orii (ICICDT, 2023)

Semiconductor Packaging Revolution in the Era of Chiplets : Keynote 1. - Yasumitsu Orii (ITC-Asia, 2023)