Pb-free high temperature solders for power device packaging. - Yasushi Yamada; Yoshikazu Takaku; Yuji Yagi; Y. Nishibe; Ikuo Ohnuma; Yuji Sutou; R. Kainuma; Kiyohito Ishida (Microelectron. Reliab., 2006)

Reliability of wire-bonding and solder joint for high temperature operation of power semiconductor device. - Yasushi Yamada; Yoshikazu Takaku; Yuji Yagi; Ikuo Nakagawa; Takashi Atsumi; Mikio Shirai; Ikuo Ohnuma; Kiyohito Ishida (Microelectron. Reliab., 2007)

Power semiconductor module using a bonding film with anisotropic thermal conduction. - Yasushi Yamada (Microelectron. Reliab., 2012)

Thermal characterizations of Cu nanoparticle joints for power semiconductor devices. - Toshitaka Ishizaki; T. Satoh; A. Kuno; A. Tane; Masashi Yanase; F. Osawa; Yasushi Yamada (Microelectron. Reliab., 2013)

Research on the Form Recognition of Fabric Products: Acquiring the Shapes of Flat, Limp Materials. - Fumiaki Osawa; Kazunori Kanou; Yasushi Yamada (Int. J. Autom. Technol., 2014)

Reliability of Cu nanoparticle joint for high temperature power electronics. - Toshitaka Ishizaki; A. Kuno; A. Tane; Masashi Yanase; F. Osawa; T. Satoh; Yasushi Yamada (Microelectron. Reliab., 2014)

Thermal simulation of joints with high thermal conductivities for power electronic devices. - Toshitaka Ishizaki; Masashi Yanase; A. Kuno; T. Satoh; Masanori Usui; F. Osawa; Yasushi Yamada (Microelectron. Reliab., 2015)

Power cycle reliability of Cu nanoparticle joints with mismatched coefficients of thermal expansion. - Toshitaka Ishizaki; Daiki Miura; Atsuki Kuno; Ryota Nagao; Syoho Aoki; Yuta Ohshima; Takuma Kino; Masanori Usui; Yasushi Yamada (Microelectron. Reliab., 2016)

Novel heatsink for power semiconductor module using high thermal conductivity graphite. - Yasushi Yamada; Masashi Yanase; Daiki Miura; Katsuhiro Chikuba (Microelectron. Reliab., 2016)