Finite element simulation of package stress in transfer molded MEMS pressure sensors. - Rudolf Krondorfer; Yeong K. Kim; Jaeok Kim; Claes-Gøran Gustafson; Timothy C. Lommasson (Microelectron. Reliab., 2004)

Warpage mechanism analyses of strip panel type PBGA chip packaging. - Yeong K. Kim; In Soo Park; Jooho Choi (Microelectron. Reliab., 2010)

Material property effects on solder failure analyses. - Yeong K. Kim; Jin Hyuk Gang; Bo-Young Lee (Microelectron. Reliab., 2011)

PBGA packaging reliability assessments under random vibrations for space applications. - Yeong K. Kim; Do Soon Hwang (Microelectron. Reliab., 2015)

Module packaging effects on MEMS airbag sensor performance for automobiles. - Dong Hyun Park; Sojin Shin; Yeong K. Kim (Microelectron. Reliab., 2017)