Underfill selection methodology for fine pitch Cu/low-k FCBGA packages. - Xuefen Ong; Soon Wee Ho; Yue Ying Ong; Leong Ching Wai; Kripesh Vaidyanathan; Yeow Kheng Lim; David Yeo; Kai Chong Chan; Juan Boon Tan; Dong Kyun Sohn; Liang Choo Hsia; Zhong Chen 004 (Microelectron. Reliab., 2009)

Design, assembly and reliability of large die and fine-pitch Cu/low-k flip chip package. - Yue Ying Ong; Soon Wee Ho; Kripesh Vaidyanathan; Vasarla Nagendra Sekhar; Ming Chinq Jong; Samuel Lim Yak Long; Vincent Lee Wen Sheng; Leong Ching Wai; Vempati Srinivasa Rao; Jimmy Ong; Xuefen Ong; Xiaowu Zhang; et al. (Microelectron. Reliab., 2010)

A Wafer Scale Hybrid Integration Platform for Co-packaged Photonics using a CMOS based Optical InterposerTM. - Suresh Venkatesan; James Lee; Simon Chun Kiat Goh; Brian Pile; Daniel Meerovich; Jinyu Mo; Yang Jing; Lucas Soldano; Baochang Xu; Yu Zhang; Aaron Voon-Yew Thean; Yeow Kheng Lim (VLSI Technology and Circuits, 2022)

A Spatial-Physics Informed Model for 3D Spiral Sample Scanned by SQUID Microscopy. - J. Senthilnath 001; Jayasanker Jayabalan; Zhuoyi Lin; Aye Phyu Phyu Aung; Chen Hao; Kaixin Xu; Yeow Kheng Lim; F. C. Wellstood (CoRR, 2025)