Low Temperature Cu to Cu Direct Bonding below 150 °C with Au Passivation Layer. - Demin Liu; Po-Chih Chen; Yi-Chieh Tsai; Kuan-Neng Chen (3DIC, 2019)

Investigation of Low Temperature Cu Pillar Eutectic Bonding for 3D Chip Stacking Technology. - Yi-Chieh Tsai; Chia-Hsuan Lee 003; Kuan-Neng Chen (3DIC, 2019)