Impact of the number of chips on the reliability of the solder balls for wire-bonded stacked-chip ball grid array packages. - Yi-Ming Jen; Ying-Lung Wu; Chih-Kai Fang (Microelectron. Reliab., 2006)

Finite element based fatigue life estimation of the solder joints with effect of intermetallic compound growth. - Yung-Chuan Chiou; Yi-Ming Jen; Shih-Hsiang Huang (Microelectron. Reliab., 2011)