An Observation on Fractal Characteristics of Individual River Plan Forms. - Ray-Shyan Wu; Yi-Shao Lai (Fractals in the Natural and Applied Sciences, 1993)

Verification of submodeling technique in thermomechanical reliability assessment of flip-chip package assembly. - Yi-Shao Lai; Tong Hong Wang (Microelectron. Reliab., 2005)

Transient analysis of the impact stage of wirebonding on Cu/low-K wafers. - Chang-Lin Yeh; Yi-Shao Lai (Microelectron. Reliab., 2005)

On solution schemes for time-independent thermomechanical analysis for structures containing polymeric materials. - Yi-Shao Lai (Microelectron. Reliab., 2006)

Characteristics of current crowding in flip-chip solder bumps. - Yi-Shao Lai; Chin-Li Kao (Microelectron. Reliab., 2006)

Electrothermal coupling analysis of current crowding and Joule heating in flip-chip packages. - Yi-Shao Lai; Chin-Li Kao (Microelectron. Reliab., 2006)

Experimental studies of board-level reliability of chip-scale packages subjected to JEDEC drop test condition. - Yi-Shao Lai; Ping-Feng Yang; Chang-Lin Yeh (Microelectron. Reliab., 2006)

Support excitation scheme for transient analysis of JEDEC board-level drop test. - Chang-Lin Yeh; Yi-Shao Lai (Microelectron. Reliab., 2006)

Transient fracturing of solder joints subjected to displacement-controlled impact loads. - Chang-Lin Yeh; Yi-Shao Lai (Microelectron. Reliab., 2006)

Evaluation of board-level reliability of electronic packages under consecutive drops. - Chang-Lin Yeh; Yi-Shao Lai; Chin-Li Kao (Microelectron. Reliab., 2006)

Electromigration of Sn-37Pb and Sn-3Ag-1.5Cu/Sn-3Ag-0.5Cu composite flip-chip solder bumps with Ti/Ni(V)/Cu under bump metallurgy. - Yi-Shao Lai; Kuo-Ming Chen; Chin-Li Kao; Chiu-Wen Lee; Ying-Ta Chiu (Microelectron. Reliab., 2007)

Evaluation of solder joint strengths under ball impact test. - Yi-Shao Lai; Hsiao-Chuan Chang; Chang-Lin Yeh (Microelectron. Reliab., 2007)

Optimal design towards enhancement of board-level thermomechanical reliability of wafer-level chip-scale packages. - Yi-Shao Lai; Tong Hong Wang (Microelectron. Reliab., 2007)

Cyclic bending reliability of wafer-level chip-scale packages. - Yi-Shao Lai; Tong Hong Wang; Han-Hui Tsai; Ming-Hwa R. Jen (Microelectron. Reliab., 2007)

Response spectra analysis for undamped structural systems subjected to half-sine impact acceleration pulses. - Tsung-Yueh Tsai; Chang-Lin Yeh; Yi-Shao Lai; Rong-Sheng Chen (Microelectron. Reliab., 2007)

Empirical correlation between package-level ball impact test and board-level drop reliability. - Chang-Lin Yeh; Yi-Shao Lai; Hsiao-Chuan Chang; Tsan-Hsien Chen (Microelectron. Reliab., 2007)

Transient analysis of drop responses of board-level electronic packages using response spectra incorporated with modal superposition. - Chang-Lin Yeh; Tsung-Yueh Tsai; Yi-Shao Lai (Microelectron. Reliab., 2007)

Effects of different drop test conditions on board-level reliability of chip-scale packages. - Yi-Shao Lai; Po-Chuan Yang; Chang-Lin Yeh (Microelectron. Reliab., 2008)

Finite element model verification for packaged printed circuit board by experimental modal analysis. - Ying-Chih Lee; Bor-Tsuen Wang; Yi-Shao Lai; Chang-Lin Yeh; Rong-Sheng Chen (Microelectron. Reliab., 2008)

Structural design optimization for board-level drop reliability of wafer-level chip-scale packages. - Tsung-Yueh Tsai; Yi-Shao Lai; Chang-Lin Yeh; Rong-Sheng Chen (Microelectron. Reliab., 2008)

Reliability evaluations for board-level chip-scale packages under coupled power and thermal cycling test conditions. - Tong Hong Wang; Yi-Shao Lai; Yu-Cheng Lin (Microelectron. Reliab., 2008)

Characteristics of ZnO thin films prepared by radio frequency magnetron sputtering. - Ping-Feng Yang; Hua-Chiang Wen; Sheng-Rui Jian; Yi-Shao Lai; Sean Wu; Rong-Sheng Chen (Microelectron. Reliab., 2008)

Investigations of solder joint damage potentials for board-level chip-scale packages subjected to consecutive drops. - Chang-Lin Yeh; Yi-Shao Lai (Microelectron. Reliab., 2008)

Towards elastic anisotropy and strain-induced void formation in Cu-Sn crystalline phases. - Jiunn Chen; Yi-Shao Lai (Microelectron. Reliab., 2009)

Electromigration on void formation of Sn3Ag1.5Cu FCBGA solder joints. - Ming-Hwa R. Jen; Lee-Cheng Liu; Yi-Shao Lai (Microelectron. Reliab., 2009)

High strain rate compression behavior for Sn-37Pb eutectic alloy, lead-free Sn-1Ag-0.5Cu and Sn-3Ag-0.5Cu alloys. - S. T. Jenq; Hsuan-Hu Chang; Yi-Shao Lai; Tsung-Yueh Tsai (Microelectron. Reliab., 2009)

Recent research advances in Pb-free solders. - Yi-Shao Lai; Ho-Ming Tong; King-Ning Tu (Microelectron. Reliab., 2009)

Alloying modification of Sn-Ag-Cu solders by manganese and titanium. - Li-Wei Lin; Jenn-Ming Song; Yi-Shao Lai; Ying-Ta Chiu; Ning-Cheng Lee; Jun-Yen Uan (Microelectron. Reliab., 2009)

Geometric design for ultra-long needle probe card for digital light processing wafer testing. - Hao-Yuan Chang; Wen-Fung Pan; Meng-Kai Shih; Yi-Shao Lai (Microelectron. Reliab., 2010)

Redistribution in wafer level chip size packaging technology for high power device applications: Process and design considerations. - Jiunn Chen; Yi-Shao Lai; Chueh-An Hsieh; Chia Yi Hu (Microelectron. Reliab., 2010)

Evaluation of the nanoindentation behaviors of SiGe epitaxial layer on Si substrate. - Bo-Ching He; Chun-Hu Cheng; Hua-Chiang Wen; Yi-Shao Lai; Ping-Feng Yang; Meng-Hung Lin; Wen-Fa Wu; Chang-Pin Chou (Microelectron. Reliab., 2010)

Effect of annealing treatment and nanomechanical properties for multilayer Si0.8Ge0.2-Si films. - Bo-Ching He; Hua-Chiang Wen; Meng-Hung Lin; Yi-Shao Lai; Wen-Fa Wu; Chang-Pin Chou (Microelectron. Reliab., 2010)

Early experience with in situ chip-to-chip alignment characterization of Proximity Communication flip-chip package. - Theresa Sze; Darko Popovic; Jing Shi; Yi-Shao Lai; James G. Mitchell; Bruce Guenin; Tsung-Yueh Tsai; Chin-Li Kao; Matthew Giere (Microelectron. Reliab., 2010)

Advances in Wafer Level Packaging (WLP). - Tong Yan Tee; Xuejun Fan; Yi-Shao Lai (Microelectron. Reliab., 2010)

Fine pitch copper wire bonding in high volume production. - Bernd K. Appelt; Andy Tseng; Chun-Hsiung Chen; Yi-Shao Lai (Microelectron. Reliab., 2011)

Investigation of growth behavior of Al-Cu intermetallic compounds in Cu wire bonding. - Jiunn Chen; Yi-Shao Lai; Yi-Wun Wang; C. Robert Kao (Microelectron. Reliab., 2011)

Warpage evolution of overmolded ball grid array package during post-mold curing thermal process. - Tz-Cheng Chiu; Hong-Wei Huang; Yi-Shao Lai (Microelectron. Reliab., 2011)

Characteristic of copper wire and transient analysis on wirebonding process. - Hsiang-Chen Hsu; Wei-Yao Chang; Chang-Lin Yeh; Yi-Shao Lai (Microelectron. Reliab., 2011)

Copper Wire Bonding. - Michael Mayer; Yi-Shao Lai (Microelectron. Reliab., 2011)

Determination of residual strains of the EMC in PBGA during manufacturing and IR solder reflow processes. - Ming-Yi Tsai; C. W. Ting; C. Y. Huang; Yi-Shao Lai (Microelectron. Reliab., 2011)

Effect of surface roughness of silicon die and copper heat spreader on thermal performance of HFCBGA. - Tong Hong Wang; Sara N. Paisner; Chang-Chi Lee; Susan Chen; Yi-Shao Lai (Microelectron. Reliab., 2011)

Evaluating nanotribological behavior of annealing Si0.8Ge0.2/Si films. - Ming-Jhang Wu; Hua-Chiang Wen; Shyh-Chi Wu; Ping-Feng Yang; Yi-Shao Lai; Wen-Kuang Hsu; Wen-Fa Wu; Chang-Pin Chou (Microelectron. Reliab., 2011)

A review of three-dimensional viscoelastic models with an application to viscoelasticity characterization using nanoindentation. - Dao-Long Chen; Ping-Feng Yang; Yi-Shao Lai (Microelectron. Reliab., 2012)

The performance and fracture mechanism of solder joints under mechanical reliability test. - Wei-Luen Jang; Tai-Siang Wang; Yen-Fen Lai; Kwang-Lung Lin; Yi-Shao Lai (Microelectron. Reliab., 2012)

Structural design guideline to minimize extreme low-k delamination potential in 40 nm flip-chip packages. - Yi-Shao Lai; Meng-Kai Shih; Chang-Chi Lee; Tong Hong Wang (Microelectron. Reliab., 2012)

Reliability of high-power LED packaging and assembly. - Cheng-Yi Liu; S. W. Ricky Lee; Moo Whan Shin; Yi-Shao Lai (Microelectron. Reliab., 2012)

Influence of trace alloying elements on the ball impact test reliability of SnAgCu solder joints. - Jenn-Ming Song; Yao-Ren Liu; Yi-Shao Lai; Ying-Ta Chiu; Ning-Cheng Lee (Microelectron. Reliab., 2012)

Guest Editorial - Low Temperature Processing for Microelectronics and Microsystems Packaging. - Tadatomo Suga; Jenn-Ming Song; Yi-Shao Lai (Microelectron. Reliab., 2012)

Reliability of micro-interconnects in 3D IC packages. - C. Robert Kao; Albert T. Wu; King-Ning Tu; Yi-Shao Lai (Microelectron. Reliab., 2013)

Study of factors affecting warpage of HFCBGA subjected to reflow soldering-liked profile. - Tong Hong Wang; Ching-I Tsai; Chang-Chi Lee; Yi-Shao Lai (Microelectron. Reliab., 2013)

Investigation of electromigration reliability of redistribution lines in wafer-level chip-scale packages. - Chin-Li Kao; Tei-Chen Chen; Yi-Shao Lai; Ying-Ta Chiu (Microelectron. Reliab., 2014)

Nanotribological properties of ALD-processed bilayer TiO2/ZnO films. - Wun-Kai Wang; Hua-Chiang Wen; Chun-Hu Cheng; Ching-Hua Hung; Wu-Ching Chou; Wei-Hung Yau; Ping-Feng Yang; Yi-Shao Lai (Microelectron. Reliab., 2014)

Thermal resistance of side by side multi-chip package: Thermal mode analysis. - Dao-Long Chen; Tei-Chen Chen; Ping-Feng Yang; Yi-Shao Lai (Microelectron. Reliab., 2015)

Power electronics packaging. - Katsuaki Suganuma; Jenn-Ming Song; Yi-Shao Lai (Microelectron. Reliab., 2015)

Characterising Arrhenius moisture diffusivity constants using non-isothermal sorption. - Ee-Hua Wong; Jarrod Cook; M. Dreno; Dao-Long Chen; Yi-Shao Lai (Microelectron. Reliab., 2015)