Kirkendall voids formation in the reaction between Ni-doped SnAg lead-free solders and different Cu substrates. - Yi-Wun Wang; Y. W. Lin; C. Robert Kao (Microelectron. Reliab., 2009)

Investigation of growth behavior of Al-Cu intermetallic compounds in Cu wire bonding. - Jiunn Chen; Yi-Shao Lai; Yi-Wun Wang; C. Robert Kao (Microelectron. Reliab., 2011)