Cost-Effective TSV Grouping for Yield Improvement of 3D-ICs. - Yi Zhao 001; S. Saqib Khursheed; Bashir M. Al-Hashimi (Asian Test Symposium, 2011)

Investigation into yield and reliability enhancement of TSV-based three-dimensional integration circuits. - Yi Zhao 001 (2014)

Online Fault Tolerance Technique for TSV-Based 3-D-IC. - Yi Zhao 001; S. Saqib Khursheed; Bashir M. Al-Hashimi (IEEE Trans. Very Large Scale Integr. Syst., 2015)

Co-optimization of fault tolerance, wirelength and temperature mitigation in TSV-based 3D ICs. - Yi Zhao 001; S. Saqib Khursheed; Bashir M. Al-Hashimi; Zhiwen Zhao (VLSI-SoC, 2016)