Influences of the moisture absorption on PBGA package's warpage during IR reflow process. - Chi-Hui Chien; Yung-Chang Chen; Yii-Tay Chiou; Thaiping Chen; Chi-Chang Hsieh; Jia-Jin Yan; Wei-Zhi Chen; Yii-Der Wu (Microelectron. Reliab., 2003)

Stability of the warpage in a PBGA package subjected to hygro-thermal loading. - Chi-Hui Chien; Thaiping Chen; Yung-Chang Chen; Yii-Tay Chiou; Chi-Chang Hsieh; Yii-Der Wu (Microelectron. Reliab., 2006)