Electromigration of Sn-37Pb and Sn-3Ag-1.5Cu/Sn-3Ag-0.5Cu composite flip-chip solder bumps with Ti/Ni(V)/Cu under bump metallurgy. - Yi-Shao Lai; Kuo-Ming Chen; Chin-Li Kao; Chiu-Wen Lee; Ying-Ta Chiu (Microelectron. Reliab., 2007)

Alloying modification of Sn-Ag-Cu solders by manganese and titanium. - Li-Wei Lin; Jenn-Ming Song; Yi-Shao Lai; Ying-Ta Chiu; Ning-Cheng Lee; Jun-Yen Uan (Microelectron. Reliab., 2009)

Influence of trace alloying elements on the ball impact test reliability of SnAgCu solder joints. - Jenn-Ming Song; Yao-Ren Liu; Yi-Shao Lai; Ying-Ta Chiu; Ning-Cheng Lee (Microelectron. Reliab., 2012)

Investigation of electromigration reliability of redistribution lines in wafer-level chip-scale packages. - Chin-Li Kao; Tei-Chen Chen; Yi-Shao Lai; Ying-Ta Chiu (Microelectron. Reliab., 2014)