A 3-D Convolutional Network for Fast and Accurate S/Z-Parameters Prediction of Si-Interposer Power Distribution Network With Through Silicon Vias. - Deguang Yang; Gang Dong; Changle Zhi; Daihang Liu; Yinghao Feng; Yintang Yang (IEEE Trans. Circuits Syst. II Express Briefs, 2024)

Multiobjective Optimization for PSIJ Mitigation and Impedance Improvement Based on PCPS/DR-NSDE in Chiplet-Based 2.5-D Systems. - Changle Zhi; Gang Dong; Wei Xiong; Deguang Yang; Daihang Liu; Yinghao Feng; Yang Wang 104; Zhangming Zhu; Yintang Yang (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2024)

Thermal Modeling and Analysis of 3D ICS with Heat Dissipation Effect of Power Distribution Networks. - Yinghao Feng; Gang Dong; Daihang Liu; Changle Zhi; Deguang Yang; Yang Wang 104; Zhangming Zhu; Yintang Yang (J. Circuits Syst. Comput., 2024)

Electrical and Thermal Characteristics Optimization in Interposer-Based 2.5-D Integrated Circuits. - Changle Zhi; Gang Dong; Deguang Yang; Daihang Liu; Yinghao Feng; Yang Wang 104; Zhangming Zhu (IEEE Trans. Very Large Scale Integr. Syst., 2025)