New insights into board level drop impact. - Ee-Hua Wong; Yiu-Wing Mai (Microelectron. Reliab., 2006)

The damped dynamics of printed circuit board and analysis of distorted and deformed half-sine excitation. - Ee-Hua Wong; Yiu-Wing Mai (Microelectron. Reliab., 2009)

Geometry effect on mechanical performance and fracture behavior of micro-scale ball grid array structure Cu/Sn-3.0Ag-0.5Cu/Cu solder joints. - H. B. Qin; X. P. Zhang; M. B. Zhou; X. P. Li; Yiu-Wing Mai (Microelectron. Reliab., 2015)